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Solder Paste - Halogen Free Ultra Life (Sn96.5/Ag3.0//Cu0.5)

Solder Paste - Halogen Free Ultra Life (Sn96.5/Ag3.0//Cu0.5)

Product Details:

X

Price And Quantity

  • 1 Gram
  • 1 INR

Product Specifications

  • New

Trade Information

  • Telegraphic Transfer (T/T), Cash on Delivery (COD)
  • IMMEDIATE Days
  • Asia
  • All India

Product Description

Product Details

Minimum Order Quantity

10 Kilogram

Brand

ARO

Weight (Gram)

500

Net Weight

500

Material Type

Paste

Packaging Type

1/2 Kg

Packaging Size

Jar

No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack.

Alloy: 96.5Sn, 3.0Ag, 0.5Cu
Flux content: 12% RMA
Particle size: Type T4 22-38 Micron

  • Typical Profile length 3-4.5 minutes
  • Initial heating rate 1-4°C
  • Soak time from 150-180°C 60-90 secs or 60-120 seconds if
  • using a faster initial heating rate to 170°C Ramp
  • From 180°C to peak 2-3°C per second
  • Time above 220° C 45-75 seconds
  • Peak temp 240-260°C* *To accommodate some LED
  • component profiles
  • Cool down 2-5°C per second

Additional Information:

  • Item Code: LFS-UFP-T4

  • Pay Mode Terms: By cash by cheque

  • Delivery Time: immediate


AROINDIA ELECTROMECH PVT. LTD.

* Tips on getting accurate quotes. Please include product name, order quantity, usage, special requests if any in your inquiry.



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