Solder Paste Lead Free SAC 305 (Sn96.5/Ag3.0/Cu0.5)

Product Description

Product Details:

No clean, low slumping, No solder balls, Controlled Viscosity, Fine pitch. Excellent wetting, 72 hour tack.

• Alloy: 96.5Sn, 3.0Ag, 0.5Cu
• Flux content: 12% RMA
• Particle size: Type T4 22-38 Micron

Typical Profile length 3-4.5 minutes

Initial heating rate 1-4°C

Soak time from 150-180°C 60-90 secs or 60-120 seconds if

using a faster initial heating rate to 170°C Ramp

From 180°C to peak 2-3°C per second

Time above 220° C 45-75 seconds

Peak temp 240-260°C* *To accommodate some LED

component profiles

Cool down 2-5°C per second

Additional Information:

• Item Code: LFS-UFP-T4

• Pay Mode Terms: By cash by cheque

• Delivery Time: immediate